HangZhouTronstol technology Co., Ltd

How to Optimize Smt Mounter Machine Equipment?(2021年)

tronstol — 2021-10-13T17:54:44+0900

https://www.tronstol.com/how-does-the-smt-mounter-machine-production-line-work.html

To increase the output of the SMT production line, the efficiency of the production line must be considered. The smt mounter machine is the key equipment in the production line, so it is of great significance to improve the production efficiency of the smt mounter machine.

1. The optimization principle of smt mounter machine
The optimization principle of the smt mounter machine depends on the structure of the equipment. The optimization of the numerical control program of each device is to make the smt mounter machine meet these conditions as much as possible during the production process, so as to achieve the highest speed of mounting and reduce the mounting time of the equipment.

When smt mounter machine optimizes the program, some principles will conflict, which requires compromises when choosing a good optimization solution.

2. Optimized software for smt mounter machine
The smt mounter machine optimization software can be used for load distribution and equipment optimization, including equipment optimization programs and production line balancing software. The optimization program of smt mounter machine is mainly optimized for the installation plan and the configuration of the feeder.

After obtaining the bom table and cad data of the component, the assembly program and the feeder configuration table can be generated. The smt mounter machine optimization program will optimize the movement path of the head and the configuration of the feeder, minimize the moving distance of the head, and save time.

Production line balancing software is an effective tool for optimizing the entire production line. The smt pick and place machine optimization software uses a certain optimization algorithm. At present, the smt pick and place machine optimization software has a certain degree of intelligence, which can complete the optimization process faster and better.

The above is the related optimization of smt pick and place machine. If you have any questions, please contact smt pick and place machine manufacturers.

Hangzhou TronStol Technology Co., Ltd., is a professional smt equipment suppliers, we provide manual smt pick and place machine, surface mount technology smt equipment, surface mount technology machine, surface mount equipment and etc. Want to know more? Please contact us.

Several Common Ways to Assemble SMD(2021年)

tronstol — 2021-10-13T17:54:22+0900

https://www.tronstol.com/products/pick-and-place-machine-tronstol-3v-advanced.html

Ⅰ. Introduction to the SMD assembly process

SMD is a surface mount device. In the initial stage of electronic circuit board production, the via assembly is completely completed manually.

The requirements of different assembled products are different, and the conditions of assembling equipment are also different, so it is important to choose a suitable assembly method. The SMD assembly process refers to the process in which SMD components suitable for surface assembly are placed on the surface of the printed circuit board according to the design of the circuit, and then assembled by soldering processes such as flow soldering or wave soldering.

Ⅱ. How to assemble SMD?
1. Single-sided hybrid assembly method
The first type is single-sided mixed assembly, that is, the surface mount device (SMD) and through-hole plug-in components are distributed on different sides of the PCB, but the soldering surface is only one-sided. This type of assembly method uses single-sided PCB and wave soldering (currently double wave soldering is generally used). There are two specific assembly methods.
(1) Paste first, that is, first mount the SMD on the B side (welding side) of the PCB, and then insert the THC on the A side.
(2) Post-attachment method is to first insert THC on the A side of the PCB, and then mount the SMD on the B side.

2. SMT double-sided hybrid assembly method
SMD and THC can be mixed and distributed on the same side of the PCB. At the same time, SMD can also be distributed on both sides of the PCB. Double-sided hybrid assembly adopts double-sided PCB, double wave soldering or reflow soldering. In this type of assembly method, there is also a difference between first and second SMD. Generally, it is reasonable to choose according to the type of SMD and the size of the PCB. Usually, the first method is more. There are two common assembly methods for this type of assembly.
(1) SMD and FHC on the same side: SMD and THC are on the same side of the PCB.
(2) Different side ways of SMD and FHC: put the surface mount integrated chip (SMIC) and THC on the A side of the PCB, and put the SMD and small outline transistor (SOT) on the B side.

Hangzhou TronStol Technology Co., Ltd., is a professional smt equipment suppliers, we provide automatic pick and place machine, surface mount technology smt equipment, surface mount technology machine, surface mount equipment and etc. Want to know more? Please contact us.

Several Commonly Used Test Methods for PCB(2021年)

tronstol — 2021-10-13T17:54:01+0900

https://www.tronstol.com/smt-assembly/

Ⅰ. The introduction of PCB test
In order to ensure the quality of PCB production, manufacturers have gone through a variety of test methods during the production process, and each test method will be tested for different PCB defects. It can be divided into two categories: electrical testing method and visual testing method. The following will specifically introduce the types of PCB testing and PCB testing steps.

Ⅱ. Commonly used test methods for PCB
1. PCB manual visual inspection
Use a magnifying glass or a calibrated microscope, and use the operator's visual inspection to determine whether the circuit board is qualified or not, and to determine when the correction operation is required, which is the most traditional testing method.
Its main advantages are low upfront cost and no test fixture, while its main disadvantages are human subjective error, high long-term cost, discontinuous defect detection, and difficulty in data collection. At present, due to the increase in PCB production and the shrinking of the wire spacing and component volume on the PCB, this method has become increasingly infeasible.

2.PCB online test
Through electrical performance testing to find manufacturing defects and test analog, digital and mixed-signal components to ensure that they meet specifications, there are several testing methods such as bed-of-needle testers and flying probe testers.
The main advantages are the low test cost of each board, strong digital and functional testing capabilities, fast and thorough short-circuit and open-circuit testing, programming firmware, high defect coverage, and easy programming. The main disadvantages are the need to test fixtures, programming and debugging time, the high cost of making fixtures, and the difficulty of use.

3.PCB function test
The functional system test is to use special test equipment in the middle stage and the end of the production line to conduct a comprehensive test on the functional modules of the circuit board to confirm the quality of the circuit board. Functional testing can be said to be the earliest automatic testing principle. It is based on a specific board or a specific unit and can be completed with various equipment.
Functional testing usually does not provide in-depth data such as foot-level and component-level diagnostics for process improvement, and requires specialized equipment and specially designed test procedures. It is complicated to write functional test programs, so it is not suitable for most circuit board production lines.

4. Automatic optical test
Also known as automatic visual testing, it is based on optical principles, comprehensively using image analysis, computer and automatic control and other technologies to test and deal with defects encountered in production. It is one of the newer PCB testing steps of confirming manufacturing defects.

5. Automatic X-ray inspection
Take advantage of the difference in X-ray absorption rate of different substances, see through the parts that need to be tested, and find defects. It is mainly used to test ultra-fine pitch and ultra-high-density circuit boards, as well as defects such as bridging, missing chips, poor alignment, etc. generated during the assembly process. It can also use its tomography technology to test internal defects of IC chips. The main advantage is the ability to test the quality of BGA soldering and embedded components without fixture cost; the main disadvantages are slow speed, high failure rate, difficulty in testing reworked solder joints, high cost, and long program development time. This is a relatively new test, and the method remains to be further studied.

6. Laser test system
It is the latest development of PCB testing technology. It uses a laser beam to scan the printed board, collects all measurement data, and compares the actual measurement value with the preset qualified limit value. Fast output, no fixtures and visual non-covered access are its main advantages; high initial cost, maintenance and use problems are its main disadvantages.

7. Size test
Use the two-dimensional image measuring instrument to measure the hole position, length and width, position and other dimensions. Since PCB is a small, thin and soft type of product, contact measurement can easily deform and cause inaccurate measurement. The two-dimensional image measuring instrument has become the best high-precision size measuring instrument.

Hangzhou TronStol Technology Co., Ltd., is a professional smt machine manufacturers, we provide smt pick and place machine, surface mount technology smt equipment, surface mount technology machine, surface mount equipment and etc. Want to know more? Please contact us.

Several Factors Affecting the Solder Paste Printing Process(2021年)

tronstol — 2021-10-13T17:53:36+0900

https://www.tronstol.com/products/pick-and-place-machine-tronstol-3v-standard.html

Ⅰ. The importance of the solder paste printing process
With the rapid development of component packaging, more and more RC components have been widely used, and surface mount technology has also developed rapidly. In its production process, the influence and effect of the solder paste printing process on the entire production process is is increasingly valued by engineers. Companies in the industry also widely agree to obtain good soldering, long-term reliable products in quality, and the first thing to pay attention to is the printing of solder paste. In production, it is not only necessary to master and use solder paste printing technology, but also to analyze the causes of problems, and apply improvement measures to production practice.

Ⅱ. Factors affecting the solder paste printing process
1. Solder paste
Solder paste is much more complicated than pure tin-lead alloy, and its main components are as follows: solder alloy particles, flux, rheology modifier, viscosity control agent, solvent, etc. We need to choose different types of solder paste; at the same time, choose a large manufacturer with perfect product process technology and stable quality. Generally, the following factors should be paid attention to when choosing solder paste:
(1) Viscosity of solder paste
(2) Tackiness of solder paste
(3) Uniformity and size of solder paste particles
(4) Metal content of solder paste

2. Template factor
(1) The material and engraving of the stencil
(2) The relationship between each part of the stencil and solder paste printing
Dimensions of the opening
The thickness of the stencil
The direction and size of the screen hole

Hangzhou TronStol Technology Co., Ltd., is a professional smt machine manufacturers, we provide pick n place machine, auto pick and place machine, automatic smt pick and place machine, pick and place automation equipment and etc. Want to know more? Please contact us.

What is the Assembly Process of Circuit Board?(2021年)

tronstol — 2021-10-13T17:53:12+0900

https://www.tronstol.com/smt-assembly/

1. What is circuit board assembly

Circuit board assembly is to process on the empty circuit board, install resistors, capacitors, chips and other components, through SMT patch, DIP plug-in and testing, etc., to form a board with certain functions. The circuit board assembly process is a simple and long process, and the specific steps are as follows.

Ⅱ. The specific steps of circuit board assembly

1. Solder paste printing
Solder paste printing is the basic step of circuit board assembly. Regardless of the type of circuit board, this step remains the same. A steel mesh made of a thin metal plate is placed on the plate. This ensures that the solder paste is only applied to the area where the components are to be installed. After applying the solder paste, remove the stencil from the board.

2. Pick and place component installation
Component installation is a pick and place activity that can be performed manually or mechanically by an automated system (such as pick and place machine for PCB assembly). In the through-hole circuit board assembly, the assembly is performed manually. In surface mount circuit board assembly, this is performed by automated machines. Automatic component mounting provides a fast, accurate and error-free circuit board assembly process.

3. Welding
Solder to connect the components on the circuit board. In the through-hole assembly, wave soldering is performed. In this case, the circuit board on which the components are mounted will move on the hot wave soldering fluid. This will liquefy the solder balls and then cool them at room temperature to solidify the solder paste. However, in the surface mount circuit board assembly, reflow soldering is performed.

4. Check
Perform inspections and quality tests to ensure the functionality of the equipment. It involves three different inspection methods, as described below.
1) Appearance/manual inspection
Manual inspection is only sufficient to check solder connections, this method is only suitable for small batches of circuit boards.
2) Automatic optical inspection (AOI)
The AOI machine has a high-resolution camera that can be aimed at different angles to test the circuit board. This type of inspection is suitable for single or double-sized circuit boards, but not enough for multi-layer complex circuit boards.
3) X-ray inspection
X-ray inspections are performed on complex circuit board designs with multi-layer component mounting. Such complex circuit boards are difficult to inspect optically.
4) Inspection and functional test after assembly
After the assembly is complete, check the circuit board again and test its function. Perform functional tests, such as microsection test, contamination test, and solderability test, to end the circuit board assembly process.

Hangzhou TronStol Technology Co., Ltd., is a professional smt machine manufacturers, we provide pcb assembly machine, pick and place packaging machine and etc. Want to know more? Please contact us.

The annual mobilization meeting in 2021(2021年)

tronstol — 2021-10-13T17:52:48+0900

https://www.tronstol.com/products/pick-and-place-machine-tronstol-3v-advanced.html

The new year 2021 has begun. At the beginning of construction, the company held a New Year mobilization meeting. All the staff gathered together to review the hard work and hard work in 2020. We listened to each department's summary of last year's work. In 2020, our company has carried out a comprehensive rectification of the company's organizational structure, and the company's goals have become clearer. Our company has always adhered to the core purpose of serving customers and the development of work under the guidance of creating value for customers. The company's R&D department has developed new projects and made breakthrough progress in product innovation. With the joint efforts of national offices and foreign agents, the company's sales department has achieved steady growth in performance. All departments have also made plans for the company's future development, and everyone will work together for 2021.

At the annual mobilization meeting, our company organized various games, and all employees promoted the cultivation of feelings in the games. Tronstol is a big family, where we experience warmth, unity and cooperation. Everyone had a happy day in joy.

This activity strengthened the construction of corporate culture and improved the cohesion and centripetal force of all employees. This also reflects the strong will of the employees, the spirit of hard work and enterprising, and the good spirit of cooperation between colleagues. Looking forward to the new year, with the efforts of all employees, the company and employees can grow together.

Hangzhou TronStol Technology Co., Ltd., is a professional smt machine manufacturers, we provide pick and place pcb machine, tabletop smt pick and place machine, desktop smt pick and place machine, surface mount soldering machine and etc. Want to know more? Please contact us.

The Advantage of Tronstol A1 mounter machine-(2)(2021年)

tronstol — 2021-10-13T17:52:18+0900

https://www.tronstol.com/products/pick-and-place-machine/

Tronstol A1 pick and place machine uses the latest industrial state machine software framework in order to support complex control logic in software. This state machine framework allows the realization of highly parallel and multiplexed logic. This also provides space for the subsequent expansion of more complex software functions. In addition, the completely independent low-coupling characteristics between state machines also completely isolate various functions in multiple interfaces. In this way, the influence and interference of the high-complexity software logic of subsequent iterations on the original logic is avoided in the framework.

In order to make it more convenient for customers to use and simplify the operation, we have adopted an integrated touch screen design for our pick and place device. We use today's advanced handheld operating interface development methods on the Internet to present complex scenes and dynamic interactions in reality in as intuitive pictures as possible. This allows customers to learn some logical concepts of the device at the fastest speed. The customer's editing operations are integrated into one interface through a dynamic interface, eliminating a large number of buttons and complicated options.

Tronstol A1 mounter machine uses the full closed-loop drive mode of grating positioning in the XY positioning drive. The optical accuracy of the grating is 1.7 filaments. The final positioning information fed back from the grating reading head on the placement head will eliminate the nonlinearity and randomness caused by the belt drive.The efficiency of the belt drive will be preserved and the error of the belt's non-rigidity will also be eliminated. Because the weight of the screw itself is very high, the effective load ratio of the placement head to the total responsibility of the motor is not high. Moreover, once the X-axis uses the high weight caused by the screw, it will also be burdened on the Y-axis, which reduces the effective load of the Y-axis.

In machine vision, we use dual cameras and 4-way flying laser vision. Double cameras ensure that the placement head can collect any feeder and feeder related information when editing and working to ensure that the camera has no dead ends. Moreover, the independent laser imaging system of each nozzle has unique technical advantages. Because the laser vision is directly embedded in the placement head, the calibration function can be achieved from reclaiming to placement. This achieves real "flying" shooting. In principle, laser vision is a cross-sectional capture technology of side projection, ultra-high-speed exposure of about 700 frames per second and optical accuracy of about 1 filament. This has inherent advantages for 0201 components. The laser vision can realize the detection of the tip of the suction nozzle through the linkage control with the height of the suction nozzle. This achieves a unified calibration of the nozzle height and ensures that the uniform height of each nozzle is within 10 filaments. Because the characteristics of the laser principle have strong anti-interference on the color and reflective characteristics of the nozzle. This has no effect on the whitening and reflection of the nozzle. It is particularly prominent in scenes such as 0201 that easily trigger the background interference of the nozzle. The laser vision is embedded in the placement head, so when the placement head is idle anytime which can detect the nozzle with the seam and the pin. Each time the work file is loaded, the laser vision will perform a round of nozzle tip diameter and concentricity detection to facilitate the user to check whether the nozzle model is correct, and in addition, paste on each component. After that, the laser will perform a routine inspection on the tip of the nozzle to ensure that the components are not brought back, which is also one of the advantages of the machine.

Hangzhou TronStol Technology Co., Ltd., is a professional smt equipment suppliers, we provide pcb smt assembly machine, pick and place packaging machine and etc. Want to know more? Please contact us.

The Advantage of Tronstol A1 mounter machine-(1)(2021年)

tronstol — 2021-10-13T17:51:55+0900

https://www.tronstol.com/products/pick-and-place-machine/

Tronstol A1 uses the architecture model which is highly modular in functional logic, power supply, and control logic. That ensure the positioning of production and after-sales problems can be as far as possible Converges to specific modules. It can greatly reduce the coupling between system modules to improve the stability and safety of the system.

The design of board separation is used in the architecture of the internal circuit. A specific functional logic is carried by a separate board. The entire system mainly includes a motherboard card, a drive board, a power supply board, and a gas circuit board. The specific functions are also shared by many small module cards. In practice, it is only necessary to replace a few small cards to quickly troubleshoot problems. Generally, there is no need to plug and unplug the connection. We also use uniformly on the connection line and the patch line High-strength connectors are widely used in the industry for design. The wiring harnesses and connectors have fool-proof designs to ensure resistance to recklessness during installation and maintenance.

The independent power supplies and protection circuits are used in the drive and supply of power. Even if an accident occurs in a module during the movement, the safety of the electronic hardware of other modules can be guaranteed.It will not occur the vicious phenomenon of continuous burning caused by one module. When the machine is abnormal or the line is faulty, we advocate opening the machine repair cover and the placement head cover for live operation to more quickly troubleshoot problems. These methods of dynamic troubleshooting during power-on are often very Efficient, but because the protection function of the electronic circuit of most other equipment and the anti-recklessness of the software logic are not sufficiently designed.Many manufacturers do not recommend this kind of rough live removal method, but the A1's own the superiority of the hardware and software architecture can allow it to perform this efficient detection method.

The entire device adopts a distributed bus architecture, and industrial-grade bus connections are used among as many as 70 to 80 sub-devices. The electronic wiring harness is greatly reduced while ensuring low-latency communication. The streamlining of the wiring harness is the stability of the system hardware premise.

Hangzhou TronStol Technology Co., Ltd., is a professional smt equipment manufacturers, we provide pick and place machine, low cost pick and place machine, pcb smt machine, pick and place packaging machine and etc. Want to know more? Please contact us.