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https://www.fastlink-electronics.com/products/flex-pcb-assembly/

One-stop solution from flexible PCB Manufacturing to flex circuit assembly. We have good method to assemble flex PCB.
FPC is a flexible circuit assembly. The printed circuit board assembly (PCBA) and welding process for FPCs (Flex PCB Assembly or Flex Circuit Assembly) are very different from the welding process for rigid PCB boards. Flex PCB is flexible because of its lack of hardness. If you do not use a special carrier board, it can not be fixed and transmitted; In addition, basic surface mount technology (SMT) processes such as printing, placement, and reflow furnace procedures could not be completed.

As one of flex pcb assembly suppliers, Fastlink manufactures 1 –12 layer flex PCB, and also provides flex PCB assembly service, full/partial BOM list procurement, and final flex PCB testing. send your flex PCB file and BOM list to get a quote for pcb and pcb fabrication and assembly now.

Special Features of FastLink's Flex PCB Assembly China

Save time: Assembly time is short

All lines are configured to save the connection work of redundant lines;

Small: smaller than PCB

It can effectively reduce the volume of the product, and increase the convenience of carrying;

Light: lighter than PCB (hardboard)

It can reduce the weight of the final product;

Thin: thinner than PCB

It can improve flexibility and strengthen the assembly of three dimensions in a limited space.

HOW DOES FLEX PCB ASSEMBLY WORK?

FPC fixation
FPC should be fixed on the carrier plate with thin and light high temperature resistant single-side adhesive to avoid FPC deviation and warping. The adhesive tape should be moderate to facilitate peeling after reflow welding and leave no adhesive on FPC.

Solder paste printing of FPC
Solder paste should have excellent thixotropy, solder paste should be able to easily print release and firmly adhere to the FPC surface, there will be no bad release-blocking mesh leakage or collapse after printing.

Patch for FPC
According to the characteristics of the product, the number of components, and the efficiency of the SMT, medium and high-speed SMT machines can be used for mounting. Since there will definitely be some gaps between FPC and the loading plate, the SMT machine needs to have the BAD MARK recognition function to improve the production efficiency.

Reflow welding of FPC
Mandatory hot air convection infrared reflow furnace should be used so that the temperature on the FPC can change more evenly and reduce the occurrence of bad welding.

Temperature curve test method

According to the actual production of the load plate interval, in the test board before and after each two loaded with FPC load plate, at the same time in the test board of THE FPC affixed with components, with high-temperature solder wire test temperature probe welding on the test point, at the same time with high-temperature resistant tape probe wire fixed on the load plate. Note that the heat-resistant tape cannot cover the test point. The test points should be selected near the solder joints and QFP pins of each side of the load plate so that the test results can reflect the real situation.

The setting of the temperature curve

Because the temperature uniformity of FPC is not good, it is best to adjust the furnace temperature to the lower limit of solder paste technical requirements. The wind speed of a back welding furnace generally adopts the lowest wind speed that the furnace can use. The chain stability of the back welding furnace is better, and there can be no jitter.

FPC inspection, testing and sub-board
Before the test, separate the plate first, make special FPC punching and pressing die, stamping and cutting, can cut out the edge of FPC neat and improve the production efficiency.