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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes.

Advantages of China BGA PCB Assembly
Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems.

Lower inductance: Because each solder ball in a BGA China circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.

Higher-density circuits: As through-hole circuits of pcb assembly BGA were more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible.

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